Star Union Technology was founded in 2019 with its headquarters located in Changshu, China, a company specialized in Back Grinder, Wafer Dicing, Singulation equipment, material and parts one-stop solution, and its global sales office in Kuala Lumpur, Malaysia.
STAR UNION is driven by the founders and a group of semiconductor senior experts from China, Japan, and Malaysia which came from various multinational semiconductor company, well known universities and overseas returnees. The R&D core team member is team up by the local and oversea personnel with more than 20 years of experience.
Provides：
DISCO Used Equipment, STAR UNION brand accessory equipment, new equipment agent, Modification, Overhaul Maintenance, Parts and Repair.
Supplied Market：
Bumping/IC/MEMS/Memory/IR Glass/WLCSP/COB/LED etc.
